EPC2012CENGR
EPC2012CENGR
Part Number:
EPC2012CENGR
Manufacturer:
EPC
Description:
TRANS GAN 200V 5A BUMPED DIE
Lead Free Status / RoHS Status:
Lead free / RoHS Compliant
Available Quantity:
72541 Pieces
Delivery Time:
1-2 days
Data sheet:
EPC2012CENGR.pdf

Introduction

ACTIVE-COMPONENT is the stocking distributor for EPC2012CENGR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EPC2012CENGR by email, we will give you a best price according your plan.
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Specifications

Condition New & Unused, Original Packing
Origin Contact us
Voltage - Test:100pF @ 100V
Voltage - Breakdown:Die Outline (4-Solder Bar)
Vgs(th) (Max) @ Id:100 mOhm @ 3A, 5V
Technology:GaNFET (Gallium Nitride)
Series:eGaN®
RoHS Status:Tape & Reel (TR)
Rds On (Max) @ Id, Vgs:5A (Ta)
Polarization:Die
Other Names:917-EPC2012CENGRTR
Operating Temperature:-40°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Part Number:EPC2012CENGR
Input Capacitance (Ciss) (Max) @ Vds:1nC @ 5V
Gate Charge (Qg) (Max) @ Vgs:2.5V @ 1mA
FET Feature:N-Channel
Expanded Description:N-Channel 200V 5A (Ta) Surface Mount Die Outline (4-Solder Bar)
Drain to Source Voltage (Vdss):-
Description:TRANS GAN 200V 5A BUMPED DIE
Current - Continuous Drain (Id) @ 25°C:200V
Capacitance Ratio:-
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