Kondisi | New & Unused, Original Packing |
---|---|
Asal | Contact us |
Vgs (th) (Max) @ Id: | 1.8V @ 250µA |
Paket Perangkat pemasok: | PowerPAK® ChipFet Dual |
Seri: | TrenchFET® |
Rds Pada (Max) @ Id, Vgs: | 36 mOhm @ 6.1A, 4.5V |
Listrik - Max: | 10.4W |
Pengemasan: | Original-Reel® |
Paket / Case: | PowerPAK® ChipFET™ Dual |
Nama lain: | SI5519DU-T1-GE3DKR |
Suhu Operasional: | -55°C ~ 150°C (TJ) |
mount Jenis: | Surface Mount |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Status Gratis Memimpin / Status RoHS: | Lead free / RoHS Compliant |
Kapasitansi Masukan (Ciss) (Max) @ VDS: | 660pF @ 10V |
Gate Charge (Qg) (Max) @ Vgs: | 17.5nC @ 10V |
FET Jenis: | N and P-Channel |
Fitur FET: | Standard |
Tiriskan untuk Sumber Tegangan (Vdss): | 20V |
Detil Deskripsi: | Mosfet Array N and P-Channel 20V 6A 10.4W Surface Mount PowerPAK® ChipFet Dual |
Current - Continuous Drain (Id) @ 25 ° C: | 6A |
Nomor Bagian Dasar: | SI5519 |
Email: | [email protected] |