Obraz |
Part Number |
Producenci |
Opis |
Widok |
|
18389 |
Vicor |
INMATE MAXI OUT LL BOB |
Zapytanie ofertowe |
|
CM2B2 |
Bel |
TEST BOARD FOR DC-DC CONVERTER |
Zapytanie ofertowe |
|
HUB1200-S |
Vicor |
BOX HOLDUP 1200UF |
Zapytanie ofertowe |
|
QPI-6LZ-01 |
Vicor |
14A ACTIVE EMI FILTER SIP 48V |
Zapytanie ofertowe |
|
18368 |
Vicor |
INMATE MINI SL BOB 5 1=10PCS |
Zapytanie ofertowe |
|
30191 |
Vicor |
HEATSINK VI-J00 HORIZ. 0.9" |
Zapytanie ofertowe |
|
43807-09 |
Vicor |
HEAT SINK FOR DCDC CNVTR/ARRAYS |
Zapytanie ofertowe |
|
FLT012A0-SZ |
GE Critical Power |
DC INPUT FILTER MODULE |
Zapytanie ofertowe |
|
32435 |
Vicor |
FULL PUSH-PIN BK 0.094" 100/BAG |
Zapytanie ofertowe |
|
PAH83L12 |
TDK-Lambda Americas, Inc. |
HEATSINK THERMAL PAD KIT FOR DC/ |
Zapytanie ofertowe |
|
PT4498N |
Luminary Micro / Texas Instruments |
BOOSTER(PT4484) 20A 48VIN VRT |
Zapytanie ofertowe |
|
PASHC |
TDK-Lambda Americas, Inc. |
HIGH CURRENT SOCKET |
Zapytanie ofertowe |
|
TPM1714BE3MG5K7C08 |
Vicor |
THREE PHASE MODULE, 1714 VIA, PC |
Zapytanie ofertowe |
|
32184 |
Vicor |
MODULE SHIELD VI-J00 WITH PEM NU |
Zapytanie ofertowe |
|
DFN51120 |
TDK-Lambda Americas, Inc. |
RESISTOR THERMAL FUSE - PFE1000 |
Zapytanie ofertowe |
|
VIZ0011 |
Vicor |
MECHNCL SAMPLE PRM HALF CHIP SMD |
Zapytanie ofertowe |
|
TEN-HS1 |
TRACO Power |
PRODUCT TYPE: DC/DC; PACKAGE STY |
Zapytanie ofertowe |
|
30199 |
Vicor |
MODULE SHIELD MAXI SLOTTED |
Zapytanie ofertowe |
|
PAH62L12 |
TDK-Lambda Americas, Inc. |
HEATSINK THERMAL PAD KIT FOR DC/ |
Zapytanie ofertowe |
|
21545 |
Vicor |
INMATE MICRO OUT XL |
Zapytanie ofertowe |
|
VI-RAM-I1 |
Vicor |
RIPPLE ATTENUATOR MODULE |
Zapytanie ofertowe |
|
30190 |
Vicor |
HEAT SINK MICRO 0.9" THRD/LONG |
Zapytanie ofertowe |
|
43807-04 |
Vicor |
HEAT SINK FOR DCDC CNVTR/ARRAYS |
Zapytanie ofertowe |
|
43806-04 |
Vicor |
HEAT SINK FOR DCDC CNVTR/ARRAYS |
Zapytanie ofertowe |
|
DC/DC BOOK OF KNOWLEDGE DE |
RECOM Power |
DC/DC BOOK OF KNOWLEDGE DE |
Zapytanie ofertowe |
|
PATP83 |
TDK-Lambda Americas, Inc. |
THERMAL PAD |
Zapytanie ofertowe |
|
30725 |
Vicor |
HEATSINK MICRO 0.9" THRU/TRANS |
Zapytanie ofertowe |
|
VI-RAM-C2 |
Vicor |
VI-RAM RIPPLE ATTENUATOR MODULE |
Zapytanie ofertowe |
|
PT4497C |
Luminary Micro / Texas Instruments |
BOOSTER(PT448) 8.5A 48VIN HZ SMD |
Zapytanie ofertowe |
|
21539 |
Vicor |
INMATE MAXI/MINI IN XL BOB |
Zapytanie ofertowe |
|
TPM1714BE3MG5K7C04 |
Vicor |
THREE PHASE MODULE, 1714 VIA, PC |
Zapytanie ofertowe |
|
F4810 |
Bel |
DC-DC CONV INP FILTER |
Zapytanie ofertowe |
|
43809-04 |
Vicor |
HEAT SINK FOR DCDC CNVTR/ARRAYS |
Zapytanie ofertowe |
|
PAH41L23 |
TDK-Lambda Americas, Inc. |
HEATSINK THERMAL PAD KIT FOR DC/ |
Zapytanie ofertowe |
|
QPI-3LZ-01 |
Vicor |
24V 7A ACTIVE EMI FILTER OPN FRM |
Zapytanie ofertowe |
|
VIZ0012 |
Vicor |
MECHNCL SAMPLE VTM HALF CHIP SMD |
Zapytanie ofertowe |
|
18376 |
Vicor |
SOCKET |
Zapytanie ofertowe |
|
HAF10L |
TDK-Lambda Americas, Inc. |
HEATSINK FULL BRICK 1" FINS |
Zapytanie ofertowe |
|
33624 |
Vicor |
HALF PUSH-PIN BLU 0.125" 100/BAG |
Zapytanie ofertowe |
|
HAH10L |
TDK-Lambda Americas, Inc. |
HEATSINK |
Zapytanie ofertowe |
|
APA503-00-002 |
Astec America (Artesyn Embedded Technologies) |
STUD MTG SOLDER FOR HEATSINK |
Zapytanie ofertowe |
|
URAM2CN3 |
Vicor |
URAM OUTPUT ATTENUATION MODULE |
Zapytanie ofertowe |
|
VIZ0007 |
Vicor |
MECHNCL SAMPLE VTM FULL CHIP SMD |
Zapytanie ofertowe |
|
LGA-HTSK-KIT-045 |
Astec America (Artesyn Embedded Technologies) |
LGA ACC KIT |
Zapytanie ofertowe |
|
APA503-00-001 |
Astec America (Artesyn Embedded Technologies) |
STUD MTG TAPPED FOR HEATSINK |
Zapytanie ofertowe |
|
M-5 |
Daburn |
BENCH ADAPTER 2.0" AC PIN SPACIN |
Zapytanie ofertowe |
|
AIM1714BB6MC7D5T08 |
Vicor |
EMI FILTER AND SINGLE PHASE AC R |
Zapytanie ofertowe |
|
21540 |
Vicor |
INMATE MICRO IN XL BOB |
Zapytanie ofertowe |
|
APA501-60-003 |
Astec America (Artesyn Embedded Technologies) |
HEATSINK (60)57.5X59X22.5MM VERT |
Zapytanie ofertowe |
|
29768 |
Vicor |
PR TRANSFORMER |
Zapytanie ofertowe |